PURPOSE: To detect the bending and the floating of a lead with high precision by using the same mechanism, and shorten the detection time, by irradiating a lead with an optical cutting beam, imaging the lead part with an image equipment, and detecting the bending or the floating on the basis of three-dimensional data of each lead on the picture image.
CONSTITUTION: The leads of a semiconductor device 1 are irradiated with an optical cutting beam 6, and a lead part 12 is imaged by an image equipment 3. On the basis of three-dimensional data of each lead obtained from the optical cutting beam 6 of each lead part 12 on the picture image picked up by the image equipment 3, at least one of the bending or the floating of the lead is detected. For example, the semiconductor device 1 is moved in the visual field of a TV camera 3; the light outputted from a semiconductor laser light source 7 is turned into the optical cutting beam 6 by a lens 8, and projected on the lead part 12 of the semiconductor device 1; the image of the optical cutting beam 6 of the lead part 12 obtained in the above process is picked up by the TV camera 3, and read and stored as picture image data by an image processing equipment 11. The bending and the floating of leads of the semiconductor device 1 are detected through a specified process.
HIRAMOTO SOTOJI
HATA SEIJI
TOMITA MASAMICHI
ISHIBASHI AKIRA
