Title:
METHOD AND EQUIPMENT FOR ELECTROPLATING
Document Type and Number:
Japanese Patent JP3661657
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for electroplating by which film composition and film thickness can be held constant nearly perfectly and equipment therefor.
SOLUTION: In the electroplating method, an anode electrode is constituted of an array of a plurality of two-dimensional microelectrodes; a potential measuring electrode is moved on the surface of a plating film during energization to measure potential distribution on the film surface, and an electrode current is individually controlled on the basis of the results to control the surface potential of the plating film of a cathode electrode to an arbitrary value constantly. The electroplating equipment is provided with the anode electrode in which the plurality of microelectrodes are two-dimensionally arranged and an electric current is supplied independently to the respective microelectrodes; a reference electrode for measuring the potential distribution on the surface of the plating film of the cathode electrode during energization; and a control means for exerting control in such a way that the electric current can be supplied independently to the respective microelectrodes of the anode electrode on the basis of the potential distribution obtained by the reference electrode so that the surface potential of the plating film of the cathode electrode can be held constant.
Inventors:
Noriaki Sugamoto
Koichiro Maki
Koichiro Maki
Application Number:
JP2002070161A
Publication Date:
June 15, 2005
Filing Date:
March 14, 2002
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
C25D7/06; C25D17/12; C25D21/12; (IPC1-7): C25D21/12; C25D7/06; C25D17/12
Domestic Patent References:
| JP2200800A | ||||
| JP2001316876A |
Attorney, Agent or Firm:
Masuaki Tanaka