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Title:
METHOD AND EQUIPMENT FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3164103
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To reduce the fluctuation of the application amounts of conductive paste to be applied for forming side face electrodes so as to be extended from one part of the side face of a component main body to one part of the adjacent face.
SOLUTION: In this method for manufacturing an electronic component, conductive paste 32 is packed in a slit 39 formed at a slit board 33, and a component main body 2 is arranged so that a side face 7 can be faced to a first main face 37 side of the slit board 33. Then, a closed member 34 constituted of an elastic body is pressurized by a protrusion 40 of a pressurizing member 35 so that the closed member 34 can be elastically deformed toward the inside part of the slit 39. Thus, the conductive paste 32 in the slit 39 can be supplied so as to be projected at the first main face 37 side, and the conducive paste 32 is applied so as to be extended from one part of the side face 7 of the component main body 2 to the upper part of one part of faces 11 and 12 adjacent to the side face 7.


Inventors:
Shingo Okuyama
Tadahiro Nakagawa
Takehiko Miura
Masato Fukuda
Application Number:
JP14757399A
Publication Date:
May 08, 2001
Filing Date:
May 27, 1999
Export Citation:
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Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G4/12; H01G4/228; H01G13/00; H01L21/48; H03H1/00; H05K3/10; H05K3/40; H05K1/09; H05K3/12; (IPC1-7): H01G4/12; H01G13/00
Domestic Patent References:
JP855765A
JP945575A
JP1145837A
JP61117242U
Attorney, Agent or Firm:
Masaaki Koshiba (1 outside)



 
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