Title:
METHOD FOR ESTIMATING SLIDING SURFACE TEMPERATURE, SEISMIC ISOLATOR, AND BUILDING
Document Type and Number:
Japanese Patent JP2016020731
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for estimating sliding surface temperature capable of easily estimating sliding surface temperature.SOLUTION: A method for estimating sliding surface temperature is provided with: a step S1 of performing an experiment by using a reduced model to calculate frictional heat Q to be generated on a sliding surface; a step S2 of performing finite element analysis of a sliding plate and a sliding bearing in one dimension along a cross section in a vertical direction to calculate an inflow ratio k; a step S3 of calculating contact ratios kof the respective points on the sliding surface; steps S4, 5 of calculating incident heat fluxes qbto be made incident on the respective points on the sliding surface, and performing the finite element analysis of the sliding plate in three dimensions by using the incident heat fluxes qbas a boundary condition to calculate temperature Tof sliding surfaces of the respective points on the sliding plate; and a step 6 of making temperature T of the sliding surface into a range larger than temperature Tmeasured by the experiment using the reduced model, and smaller than the temperature calculated by the step S5.SELECTED DRAWING: Figure 2
Inventors:
NAKAMURA MASATOSHI
HIBINO HIROSHI
HIBINO HIROSHI
Application Number:
JP2014145474A
Publication Date:
February 04, 2016
Filing Date:
July 15, 2014
Export Citation:
Assignee:
TAISEI CORP
International Classes:
F16F15/02; E04H9/02
Domestic Patent References:
| JP2004084908A | 2004-03-18 | |||
| JP2009002118A | 2009-01-08 | |||
| JP2013545042A | 2013-12-19 |
Attorney, Agent or Firm:
Hisato Kuroiwa