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Title:
METHOD FOR ESTIMATING SUPPORT STATE OF ELECTRONIC EQUIPMENT CASING, AND ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2009053949
Kind Code:
A
Abstract:

To provide a method for estimating a support state of an electronic equipment casing, capable of estimating a dynamic support structure of an electronic equipment casing laid in a rest state at practical cost.

In the method for estimating a support state of an electronic equipment casing, vibration for detecting the dynamic support state is given from an exciting device to a casing of electronic equipment provided with the exciting device. The vibration responding characteristic to the given vibration is detected by an acceleration sensor provided in a place different from that of the exciting device, and compared with correlation information between vibration response characteristic and dynamic support state preliminarily stored in the electronic equipment to estimate the support state.


Inventors:
Mukai, Minoru
Omori, Takahiro
Yamamoto, Daisuke
Application Number:
JP2007000220281
Publication Date:
March 12, 2009
Filing Date:
August 27, 2007
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
G06F1/00; G01M7/02; G06F1/20; G11B21/08; G11B25/04