To provide a method of evaluating a piezoelectric film capable of acquiring displacement of the piezoelectric film having a small measurement error.

In this evaluation method of the piezoelectric film 31, first of all, a sample 12 including the piezoelectric film 31 is fixed to a sample fixing tool 20. In the sample 12, the first electrode 42 and the second electrode 43 are formed to sandwich the piezoelectric film 31 in order to apply a voltage to the piezoelectric film 31. Then, a probe 33 is brought into direct contact with a measuring surface in the crossing direction to the electric field direction of the piezoelectric film 31. Thereafter, while applying the voltage to the piezoelectric film 31, the probe 33 is allowed to directly scan a measuring domain, to thereby measure a piezoelectric characteristic (the first displacement) of the piezoelectric film 31.