Title:
METHOD FOR EVALUATING SLURRY FOR SLICING AND SLURRY
Document Type and Number:
Japanese Patent JP3389141
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a slurry which eliminates the need for the slicing test of an ingot or the like and has characteristics suitable for slicing by a wire saw.
SOLUTION: A slurry for slicing of which the viscosity measured by a cone plate-type viscometer capable of measuring viscosity under different shearing speed conditions is 400-700 mPa.sec at a shearing speed of 2/sec and 50-300 mPa.sec at a shearing speed of 380/sec is prepared. Since the slurry easy to enter a wire groove up to the deep part thereof during slicing and high in cutting efficiency can be used, an ingot or the like is sliced efficiently.
Inventors:
Hiroshi Oishi
Keiichiro Asakawa
Junichi Matsuzaki
Akio Ashida
Keiichiro Asakawa
Junichi Matsuzaki
Akio Ashida
Application Number:
JP11870099A
Publication Date:
March 24, 2003
Filing Date:
April 26, 1999
Export Citation:
Assignee:
Super Silicon Laboratory Co., Ltd.
Daichi Chemical Industry Co., Ltd.
Daichi Chemical Industry Co., Ltd.
International Classes:
B24B57/02; B24B27/06; B28D1/02; B28D5/00; B28D5/04; G01N11/14; G01N33/28; (IPC1-7): G01N11/14; B24B27/06; B24B57/02; B28D5/04
Domestic Patent References:
| JP344535A | ||||
| JP5011075A | ||||
| JP658864A | ||||
| JP1153938A |
Attorney, Agent or Firm:
Wataru Ogura
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