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Title:
METHOD OF FABRICATING BUBBLE MEMORY CHIP
Document Type and Number:
Japanese Patent JPS5518019
Kind Code:
A
Abstract:

PURPOSE: To cover beforhand the effective region of a GdGa garnet (GGG) with a film, coating thereon Pt and then lifting off the same thereby to prevent detrimental influence of dicing.

CONSTITUTION: A photoresist pattern 8 is prepared on a non-magnetic substrate GGG 7, and Pt 9 is evaporated thereon in a length of about 2000 . After lifting the resist off, the substrate is slightly etched with phosphoric acid. Thereafter, a magnetic film 10 is produced by liquid-phase epitaxial growth thereby to obtain a desired magnetic film substrate. An abnormal bubble inhibiting film, an insulating film, a conductor and a permalloy are successively laminated thereon thereby to fabricate a bubble memory chip substrate. Thereafter, the substrate is subjected to dicing along the Pt line 9'. According to this method, there is no magnetic piece in the periphery of the bubble memory chip and hence the bubble memory chip of excellent bubble memory performance characteristics can be obtained.


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Inventors:
OKU TOSHIO
Application Number:
JP9048878A
Publication Date:
February 07, 1980
Filing Date:
July 26, 1978
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
G11C11/14; H01F10/00; H01F41/14; H01F41/28; (IPC1-7): G11C11/14; H01F10/00; H01F41/14