Title:
METHOD FOR FABRICATING PIEZOELECTRIC PLATES, AND FLUIDIC ASSEMBLY SOLUTION OF PIEZOELECTRIC PLATES
Document Type and Number:
Japanese Patent JP2017220666
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for fabricating high annealing temperature piezoelectric structures compatible with low-cost thin-film sensor devices.SOLUTION: A method is provided for fabricating piezoelectric plates. An anti-corrosion layer is formed overlying a growth substrate. A template layer, with openings exposing anti-corrosion layer surfaces, is formed over the anti-corrosion layer. An adhesion layer/first electrode material stack is selectively deposited in the openings on the anti-corrosion layer surfaces, and a piezoelectric material is deposited on the stack. Then, a second electrode is formed on the piezoelectric material. Using the second electrode as a hardmask, the piezoelectric material is etched to form polygon-shaped structures, such as disks, at positions in contact with the anti-corrosion layer. After removing the template layer and annealing, the polygon-shaped structures are separated from the anti-corrosion layer. With the proper choice of growth substrate material, the annealing can be performed at a relatively high temperature.SELECTED DRAWING: Figure 1
Inventors:
MARK ALBERT CROWDER
ZHAN CHANGQING
KAREN YURI NISHIMURA
PAUL J SCHUELE
ZHAN CHANGQING
KAREN YURI NISHIMURA
PAUL J SCHUELE
Application Number:
JP2017100161A
Publication Date:
December 14, 2017
Filing Date:
May 19, 2017
Export Citation:
Assignee:
SHARP KK
International Classes:
H01L41/331; C04B41/80; H01L41/113; H01L41/187; H01L41/193; H01L41/318; H01L41/332; H01L41/43; H01L41/45; H04R31/00
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| JP2013225546A | 2013-10-31 | |||
| JPS5115239B1 | 1976-05-15 | |||
| JPS6214484A | 1987-01-23 | |||
| JP2013225546A | 2013-10-31 | |||
| JPS5115239B1 | 1976-05-15 | |||
| JP2012104715A | 2012-05-31 | |||
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| JPH07202291A | 1995-08-04 | |||
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Attorney, Agent or Firm:
Harakenzo world patent & trademark
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