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Title:
METHOD FOR FABRICATION OF LEAD FRAME
Document Type and Number:
Japanese Patent JPS5230164
Kind Code:
A
Abstract:

PURPOSE: To improve electric contact of lead frame, which is formed by combining mechanically materials used in resin-sealed, semiconductor device, etc.


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Inventors:
SHIMIZU HIROAKI
TATSUMI YOSHIAKI
NISHIKAWA TAKATOSHI
Application Number:
JP10616675A
Publication Date:
March 07, 1977
Filing Date:
September 02, 1975
Export Citation:
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Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
B21D39/00; H01L21/48; H01L21/60; H01L23/48; (IPC1-7): B21D39/00; H01L21/48; H01L21/60



 
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