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Patent Searching and Data


Title:
METHOD FOR FEEDING RESIN FILM AND APPARATUS FOR USE THEREIN
Document Type and Number:
Japanese Patent JP2007022020
Kind Code:
A
Abstract:

To provide a method for feeding which allows the precise and stable supply of a resin film having a thickness of, for example, 10-500 μm to a predetermined processing means or storage means without generating form defects such as wrinkles and curls regardless of whether it has airtightness or not.

The method comprises the continuous steps of: lapping an unvulcanized rubber sheet 14 cut in a predetermined length while conveying horizontally the long resin film 12 backed with a sheet 13 over the surface of the resin film 12 successively from its front end; removing the backing sheet 13 from the resin film 12 and sequentially cutting the resin film 12 in a predetermined length after completion of lapping it, and supplying the resin film 12 to a molding roll 7.


Inventors:
Matsushima, Toshiaki
Application Number:
JP2005000211226
Publication Date:
February 01, 2007
Filing Date:
July 21, 2005
Export Citation:
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Assignee:
BRIDGESTONE CORP
International Classes:
B29D30/08; B65G57/11