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Title:
METHOD FOR FILLING DIE WITH RAW POWDER, AND POWDER COMPACTING
Document Type and Number:
Japanese Patent JP2002053901
Kind Code:
A
Abstract:

To provide a method for filling a die with raw powder, and a powder compacting die capable of improving the productivity of green compact by rapidly filling the raw powder in a forming hole, and supplying a green compact having small variance in weight and deviation in density.

A lower punch 20 is moved while a side surface forming die 13 is moved upward so that an upper surface 10a of the side surface forming die 13 is maintained as high as an upper end face 20a of the lower punch 20, and a feeder 40 is moved upward above a through hole 11 in the side surface forming die 13. Next, the feeder 40 is located above the through hole 11, the lower punch 20 is pulled downward below the side surface forming die 13, and the raw powder M is filled in a hole H formed by the side surface forming die 13 and the lower punch 20 in a sucking manner.


Inventors:
KURODA IKUO
Application Number:
JP2000239153A
Publication Date:
February 19, 2002
Filing Date:
August 07, 2000
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B30B11/00; B22F3/035; B30B11/02; (IPC1-7): B22F3/035; B30B11/00; B30B11/02
Attorney, Agent or Firm:
Masatake Shiga (6 people outside)