Title:
METHOD FOR FILM FORMING, METHOD FOR MANUFACTURING SUBSTRATE FOR LIQUID CRYSTAL, SUBSTRATE FOR LIQUID CRYSTAL MANUFACTURED THEREBY, LIQUID CRYSTAL DEVICE AND ELECTRONIC INSTRUMENT USING THE SAME AND FILM FORMING DEVICE
Document Type and Number:
Japanese Patent JP2002023165
Kind Code:
A
Abstract:
To provide a method for film forming a film with uniform film thickness in a substrate surface, a method for manufacturing a substrate for a liquid crystal, the substrate for the liquid crystal manufactured thereby, a liquid crystal device and an electronic instrument using the same and a film forming device.
A coated film is formed on a substrate 340 by supplying an alignment layer material from a nozzle 320 for the alignment layer material while rotating the substrate 340 and subsequently the coated film is dried by supplying gas from a gas nozzle 310 to the coated film while rotating the substrate 340.
Inventors:
YAZAKI MASAYUKI
Application Number:
JP2000207075A
Publication Date:
January 23, 2002
Filing Date:
July 07, 2000
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
G02F1/13; B05C5/00; B05C9/12; B05C11/08; B05D1/40; B05D7/00; G02F1/1333; G02F1/1337; (IPC1-7): G02F1/1337; B05C5/00; B05C9/12; B05C11/08; B05D1/40; B05D7/00; G02F1/13; G02F1/1333
Attorney, Agent or Firm:
Masanori Ueyanagi (1 outside)