To provide an adhesive sheet for an electronic member with its adhesive agent layer hardened by the irradiation of a radiation superior to the adhesion of an adherend and capable of suppressing a separation between the adhesive agent layer and a support.
The adhesive sheet comprises a support (1), and an adhesive agent layer (2) on one side or on both sides of the support (1). The adhesive agent layer (2) comprises a radiation polymerization compound (B) having a vinyl acetate polymer (A) and an acryloyl group or a metacryloyl group not less than three per molecule, and a radiation polymerization compound (C) having the acryloyl group or the metacryloyl group not more than two per molecule. The total of the (B) component and the (C) component to 100 pts.wt. of the (A) is not less than 20 pts.wt., and the weight ratio (B)/(C) is ≤1. The adhesive sheet is suitable for the adhesive sheet for a semiconductor wafer or an electronic board.
FUJIMURA TETSUO
SHIMIZU MIKIO
ARAKI KIICHI
HATAKEYAMA YUJI
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