Title:
有機膜の平坦化方法
Document Type and Number:
Japanese Patent JP4290905
Kind Code:
B2
Abstract:
An organic film is coated on an insulating substrate and an organic solvent is infiltrated into the organic film to cause dissolution of the organic film to flatten the organic film. Thereafter, the flattened organic film is subjected to heat treatment at temperatures of 100 to 180° C. to evaporate the organic solvent included in the organic film. Evaporating the organic solvent included in the organic film at relatively low temperatures, i.e., temperatures of 100 to 180° C. makes it possible to reduce thermal stress on a wiring layer covered by the organic film and provide flatness of the surface of the insulating substrate.
Inventors:
Shusaku Kido
Application Number:
JP2001209410A
Publication Date:
July 08, 2009
Filing Date:
July 10, 2001
Export Citation:
Assignee:
nec LCD Technology Co., Ltd.
International Classes:
G02B5/20; G02F1/1333; B05D3/10; G02F1/1343; G02F1/1368; G09F9/30; G09F9/35; H01L21/312; H01L21/3205; H01L21/768; H01L23/522; H01L29/786
Domestic Patent References:
| JP516677A | ||||
| JP51150279A | ||||
| JP36396A |
Attorney, Agent or Firm:
Haruo Hamada