Title:
METHOD FOR FORMING ANTENNA FOR CONTACTLESS IC MODULE
Document Type and Number:
Japanese Patent JP3804292
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To efficiently obtain an antenna for a contactless IC module by making half cut in the metal layer provided on a holding substrate in depth that divides the metal layer and does not divide the holding substrate with an insulating pattern shape of an antenna line.
SOLUTION: After a metal layer 4 is provided on a holding substrate 3 for arranging this contactless IC module, half cut 5 is made between an antenna line with an insulation pattern in depth where the metal layer 4 is divided and also the holding substrate 3 is not divided by using a cutting form. Thus, an antenna where an insulating part 7 is arranged between the antenna line 6 is formed by the half cut 5. Because there is the anxiety that flashes take place at a part of the metal layer 4 by such reasons with which the cutting quality of a blade is dull and the pressure of pushing the blade is low when half cut processing is also performed and that flashes facing in an antenna line direction come into contact with each other to perform energizing, an overcoat layer is provided with a film, etc., on the metal layer 4 in the case of avoiding such a situation.
Inventors:
Yasuo Kagami
Toru Maruyama
Toru Maruyama
Application Number:
JP27896098A
Publication Date:
August 02, 2006
Filing Date:
September 30, 1998
Export Citation:
Assignee:
Toppan Forms Co., Ltd.
International Classes:
G06K19/07; B26D3/06; G06K19/077; H01Q1/38; H01Q7/00; (IPC1-7): G06K19/07; G06K19/077; H01Q1/38; H01Q7/00; //B26D3/06
Domestic Patent References:
| JP9044762A | ||||
| JP10026758A |
Attorney, Agent or Firm:
Teruo Akimoto
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