Title:
METHOD FOR FORMING ANTICORROSION LAYER
Document Type and Number:
Japanese Patent JP2007021583
Kind Code:
A
Abstract:
To provide a method for forming an anticorrosion layer, and more particularly, a method for forming an anticorrosion layer against high corrosivity of lead-free solders.
The method for forming an anticorrosion layer comprises: a step of firstly providing an article having a metal surface; a step of then providing a ceramic material having oxide, nitride, carbide, boride or a mixture of oxide, nitride, carbide and boride; a step of then adhering the ceramic material to the metal surface of the article; and a step of finally bonding the ceramic material to the metal surface of the article. The article is a tin slot, peripherals of the tin slot or a temperature probe.
Inventors:
CHIANG HUANN-WU
HSU CHI-SHIUNG
CHEN A-TZU
CHOU JAW-MIN
YU MIN-HUI
HSU CHI-SHIUNG
CHEN A-TZU
CHOU JAW-MIN
YU MIN-HUI
Application Number:
JP2006194717A
Publication Date:
February 01, 2007
Filing Date:
July 14, 2006
Export Citation:
Assignee:
TANGTECK EQUIPMENT INC
International Classes:
B23K1/08; B23K3/06; C23C26/00; C23D5/00
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori
Atsuo Mori