Title:
METHOD OF FORMING ARRAY CIRCUIT ON SURFACE OF SUBSTRATE
Document Type and Number:
Japanese Patent JPH08236779
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To obtain nearly uniform cross-section at all places in the length direction and to maximize the conductivity of a scanning line, by forming electrical coupling parts at 1st, 2nd, and 3rd coupling points, so that a signal of an (m)th scanning line controls (m)th conductivity of a 1st line between an (n)th data line and a lead for data. SOLUTION: At a proper coupling point, an electric coupling part is formed which is denoted as D1. A part forms an electrical coupling part between an (n)th data line 32 and a semiconductor line 42 which is denoted as D2. A 2nd part forms as electrical coupling part between the semiconductor line 42 and the data lead of an element 40 which is denoted as D3. A 3rd part of the this function forms an electrical coupling part between an (m)th scanning line 30 and a semiconductor line 33. Because of those coupling parts, a signal of the (m)th scanning line 30 control the conductivity of a channel 46. Here, those functions can be implemented by many methods by utilizing technologies for forming circuits on substrates.
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Inventors:
II UEI UU
Application Number:
JP34298895A
Publication Date:
September 13, 1996
Filing Date:
December 28, 1995
Export Citation:
Assignee:
XEROX CORP
International Classes:
G02F1/136; G02F1/133; G02F1/1368; H01L21/336; H01L21/768; H01L23/482; H01L23/52; H01L23/532; H01L23/538; H01L27/12; H01L29/786; G02F1/1362; (IPC1-7): H01L29/786; G02F1/133; G02F1/136; H01L21/336; H01L27/12
Attorney, Agent or Firm:
Masashi Kobori (1 person outside)