To provide a method for forming a coated film which is suitable for manufacturing an MEMS.
In the first coating process, a coating liquid is heated with a hot plate 4 to be re-flowed. By this heating treatment, the coating liquid flows down and a coated film 7 can be formed at least from the bottom part of a recessed part to an intermediate depth position of a wall part. Then in the second coating process, since the coating liquid 9 sprayed from a spray nozzle is difficult to reach the bottom part of the recessed part, the coated film 10 is formed in a region from the intermediate depth position of the recessed part to the upper surface of the protruded part 3 to be baked. The coated film 11 with uniform thickness is formed on the total surface of the recessed part by the coated film 10 and the above coated film 7.
MIYAMOTO HIDENORI
SHIMURA HIDEKAZU
TOYOTA GAKUEN
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