Title:
METHOD FOR FORMING CONDUCTIVE METAL PORTION, LIGHT-PERMEABLE CONDUCTIVE FILM, AND ELECTROMAGNETIC WAVE SHIELDING MATERIAL
Document Type and Number:
Japanese Patent JP2009059769
Kind Code:
A
Abstract:
To provide a highly light-permeable conductive film and an electromagnetic wave shielding material.
In a method for forming a conductive metal portion by exposing a pattern of a photosensitive material having at least one layer containing silver halide particles on a support and then performing a development step, a fixing step and a physical development step in session, a step for dissolving silver is performed additionally. A light-permeable conductive film and an electromagnetic wave shielding material with high permeability are also provided.
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Inventors:
GOTO MASANORI
UNO MITSUHIKO
SAKATA KAZUHIKO
UDA TAKASHI
UNO MITSUHIKO
SAKATA KAZUHIKO
UDA TAKASHI
Application Number:
JP2007223840A
Publication Date:
March 19, 2009
Filing Date:
August 30, 2007
Export Citation:
Assignee:
KONICA MINOLTA HOLDINGS INC
International Classes:
H05K9/00; B32B9/00; G02B5/22; G03C5/26; G09F9/00; H01B5/14; H01B13/00