Title:
METHOD OF FORMING CONTACT COUPLING FOR SEMICONDUCTOR CHIP
Document Type and Number:
Japanese Patent JPS57112081
Kind Code:
A
Inventors:
HERUMAN KUNIIPUKANPU
DEIITORITSUHI RISUTOU
DEIITORITSUHI RISUTOU
Application Number:
JP18430781A
Publication Date:
July 12, 1982
Filing Date:
November 17, 1981
Export Citation:
Assignee:
SIEMENS AG
International Classes:
H01L29/80; H01L21/338; H01L21/78; H01L23/12; H01L23/31; H01L23/482; H01L23/66; H01L29/812; (IPC1-7): H01L23/12; H01L29/80