Title:
焼成ペースト用銅微粒子および銅焼成膜の形成方法
Document Type and Number:
Japanese Patent JP5342603
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a copper particulate for a paste for low temperature firing, which can form a dense and low-resistant fired film on a resin substrate, and to provide a method for forming a fired copper film.SOLUTION: In the paste containing copper particulates dispersed therein, which is used when a wiring pattern is applied on the substrate in screen printing and a conductive fired film is formed in a firing step, the copper particulate for the paste for low temperature firing contains 30-70 mass% of a copper particulate having an average particle diameter of 40 nm or less and 70-30 mass% of a copper particulate that has mass at least 100 times or more than that of the copper particulate and an average particle diameter of 200-800 nm. The method for forming the low-resistant fired film on the resin substrate comprises: using the paste which contains the copper particulates for the paste for low temperature firing dispersed therein; and firing the paste at a firing temperature of 250°C or lower in a hydrogen-containing nitrogen gas atmosphere.
Inventors:
Yoshitake Masayoshi
Nobuyuki Ito
Nobuyuki Ito
Application Number:
JP2011114330A
Publication Date:
November 13, 2013
Filing Date:
May 23, 2011
Export Citation:
Assignee:
Fukuda Metal Foil & Powder Co., Ltd.
International Classes:
H01B1/00; B22F1/00; B22F1/02; H05K1/09; H05K3/12
Domestic Patent References:
| JP2007258123A | ||||
| JP2011065783A | ||||
| JP2008146991A | ||||
| JP2010135140A |