METHOD FOR FORMING DIELECTRIC FILM AND DIELECTRIC FILM

Title:

METHOD FOR FORMING DIELECTRIC FILM AND DIELECTRIC FILM

Document Type and Number:

Japanese Patent JP2004259869

Kind Code:

A

Abstract:

To provide a method for forming a dielectric film in which productivity can be improved largely by lowering a process temperature and treating a wide area in a short time in the formation of the dielectric film, and to provide the dielectric film.

The method for forming the dielectric film contains the formation of a dielectric-film precursor film by using a coating liquid comprising at least one of (A) an organometallic compound, or (B) the hydrolytic condensate of the organometallic compound and the formation of the dielectric film by irradiating the precursor film with light by using a flash lamp 1.

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Inventors:

SHINODA TOMOTAKA
YAMADA KINJI
KARASAWA TAKESHI
MATSUSHITA KENICHIRO
OKUMURA KATSUYA

Application Number:

JP2003047621A

Publication Date:

September 16, 2004

Filing Date:

February 25, 2003

Export Citation:

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Assignee:

JSR CORP
USHIO ELECTRIC INC
OCTEC INC

International Classes:

C01G23/00; C01G35/00; H01L21/316; (IPC1-7): H01L21/316; C01G23/00; C01G35/00

Domestic Patent References:

JP2002057301A

2002-02-22

Attorney, Agent or Firm:

Mitsue Obuchi
Yukio Fuse
Inoue Ichi

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