Title:
METHOD OF FORMING ELECTRONIC CIRCUIT, WIRING BOARD, ITS MANUFACTURING METHOD, MULTICHIP MODULE, AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3857112
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method by which a multichip module that is provided with high-density wiring having excellent electrical characteristics and is molded with a molding resin can be formed.
SOLUTION: In this method the wiring having excellent electrical characteristics is formed by forming wiring composed of an electroplated copper film and an electroplated nickel film on Cr/Cu, on which signal passing wiring joined to solder is formed by sputtering by using Cr/Cu/Cr wiring formed at a portion for grounding by sputtering. In the manufacturing process of the wiring, the wiring can be formed efficiently by using a long thin stainless substrate, because the substrate can be taken up in a roll.
Inventors:
Hiroyuki Tenmei
Kinhide Yamaguchi
Shigeharu Tsunoda
Hozoji Hiroyuki
Seiji Kishimoto
Yuji Yamashita
Yuichi Sukegawa
Kinhide Yamaguchi
Shigeharu Tsunoda
Hozoji Hiroyuki
Seiji Kishimoto
Yuji Yamashita
Yuichi Sukegawa
Application Number:
JP2001365790A
Publication Date:
December 13, 2006
Filing Date:
November 30, 2001
Export Citation:
Assignee:
株式会社日立製作所
日立マクセル株式会社
日立マクセル株式会社
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP1136345A | ||||
| JP10321989A | ||||
| JP8241914A | ||||
| JP11016961A | ||||
| JP11186434A | ||||
| JP2000058705A | ||||
| JP2001077499A | ||||
| JP2001177010A |
Attorney, Agent or Firm:
Nitto International Patent Office
Katsuo Ogawa
Kyosuke Tanaka
Katsuo Ogawa
Kyosuke Tanaka