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Patent Searching and Data


Title:
METHOD FOR FORMING EMBOSSED PATTERN ON COPPER PLATE
Document Type and Number:
Japanese Patent JPS5823521
Kind Code:
A
Abstract:

PURPOSE: To adjust optionally the degree of depth of an embossed pattern and to form the embossed pattern on a copper plate, by putting a blanking template consisting of a thin metallic plate on a base plate and superposing the copper plate on this template and press-beating the copper plate.

CONSTITUTION: After a blanking template 2 consisting of a thin metallic plate is put on a hard base plate 1, a copper plate 3 to be worked is superposed on the blanking template 2. The copper plate 3 is press-beaten from the upper face by a hammer which is made of an urethane resin and has the press-beating face formed hemispherically approximately, thus forming an embossed pattern on the surface of the copper plate 3 in accordance with the blanking pattern of the blanking template 2 consisting of the thin metallic plate. Plural stamping temlats 2 where blanking patterns 2a of the same size and the same form are formed are laminated concentrically to increase the depth of blanking patterns 2a.


Inventors:
Okamoto, Junpei
Application Number:
JP1981000120974
Publication Date:
February 12, 1983
Filing Date:
July 31, 1981
Export Citation:
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Assignee:
OKAMOTO JUNPEI
International Classes:
B21D31/00; B21D31/06; B44C1/24; (IPC1-7): B21D31/00; B44C1/24
Domestic Patent References:
1975-04-02
1979-10-17