Title:
METHOD OF FORMING FINE PATTERN
Document Type and Number:
Japanese Patent JP2002344117
Kind Code:
A
Abstract:
To easily form a copper wiring pattern having the designed width and thickness.
After copper foil having a thickness of ≤12 μm is patterned by a subtractive method, the pattern is plated with copper by the copper electroplating method.
Inventors:
IIDA MASAFUMI
Application Number:
JP2001142562A
Publication Date:
November 29, 2002
Filing Date:
May 14, 2001
Export Citation:
Assignee:
NIPPON CMK KK
International Classes:
C25D5/18; C25D7/00; H05K3/18; (IPC1-7): H05K3/18; C25D5/18; C25D7/00
Domestic Patent References:
| JP2000031612A | 2000-01-28 | |||
| JPS644093A | 1989-01-09 | |||
| JP2000294903A | 2000-10-20 | |||
| JPH02114693A | 1990-04-26 | |||
| JP2000087292A | 2000-03-28 |
Attorney, Agent or Firm:
Miyuki Ariga (6 people outside)
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