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Title:
METHOD OF FORMING HEAT INSULATING PATTERN COATING COMPOUND COMPOSITION AND HEAT INSULATING PATTERN FILM OF COATING
Document Type and Number:
Japanese Patent JPS6239674
Kind Code:
A
Abstract:

PURPOSE: To titled composition for forming heat insulating pattern on a wall face, floor level, etc., of building, obtained by blending a coating compound composition consisting of a thermoplastic resin, pigment, extender pigment, etc., with a thermally expandable microcapsules in a fixed ratio.

CONSTITUTION: (A) A coating compound composition comprising a thermoplastic resin (e.g., acrylic ester, etc.,) as a vehicle is blended with (B) 10W80pts.wt. based on 100pts.wt. thermoplastic resin of thermally expandable micocapsules, to give the aimed composition. This composition is directly applied to an arbitrary wall, ceiling, etc., or an undercoating material is applied to it, the composition is applied and dried and a heating tool is brought into contact with the surface of the coated material to expand the film of coating and to give pattern. The resin of the component A and the core resin of the microcapsule of the component B are the same resin, the expansion ratio of the component B is ≤80vol. times and the temperature to make expansion possible is preferably 80W180°C.


Inventors:
ATOMURA SHUICHI
Application Number:
JP17818185A
Publication Date:
February 20, 1987
Filing Date:
August 12, 1985
Export Citation:
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Assignee:
SHIKOKU KAKEN KOGYO KK
International Classes:
C09D5/00; C09D5/28; (IPC1-7): C09D5/00; C09D5/28
Domestic Patent References:
JPS536340A1978-01-20
JPS5252929A1977-04-28
JPS57135873A1982-08-21
JPS5630473A1981-03-27



 
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