PURPOSE: To titled composition for forming heat insulating pattern on a wall face, floor level, etc., of building, obtained by blending a coating compound composition consisting of a thermoplastic resin, pigment, extender pigment, etc., with a thermally expandable microcapsules in a fixed ratio.
CONSTITUTION: (A) A coating compound composition comprising a thermoplastic resin (e.g., acrylic ester, etc.,) as a vehicle is blended with (B) 10W80pts.wt. based on 100pts.wt. thermoplastic resin of thermally expandable micocapsules, to give the aimed composition. This composition is directly applied to an arbitrary wall, ceiling, etc., or an undercoating material is applied to it, the composition is applied and dried and a heating tool is brought into contact with the surface of the coated material to expand the film of coating and to give pattern. The resin of the component A and the core resin of the microcapsule of the component B are the same resin, the expansion ratio of the component B is ≤80vol. times and the temperature to make expansion possible is preferably 80W180°C.
JPS536340A | 1978-01-20 | |||
JPS5252929A | 1977-04-28 | |||
JPS57135873A | 1982-08-21 | |||
JPS5630473A | 1981-03-27 |