To provide a technology for forming an inner surface layer obtaining a layer having excellent uniformity, corrosion-resistance, peel-off resistance or the like in which the formation is easy and efficient when the inner surface conductive layer is formed on a conductive connection device such as a compression connection sleeve.
In this method, the inner surface layer is formed on an inner surface of a hollow part in the conductive connection device provided with a conductive body; and the hollow part of a solid pole shape positioned at the inside thereof and having an opening end. A plating liquid is poured to the hollow part and a base material body for plating is arranged at a predetermined position in the hollow part. The plating is carried out by energizing between the base material body and the conductive body and the inner surface layer comprising the plating layer is formed on the inner surface of the hollow part.
NISHIDA EIJI
KATO ATSUSHI
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