PURPOSE: To facilitate local supply of a solder for individually soldering QFP type package by fixing a padlike solder to a suction holder similarly to an LSI body.

CONSTITUTION: A solder film 13 formed at the same pitch as that of pads is fixed to a solder holder 12 having the same shape as or a shape near a QFP package body 9, and a solder to be accurately aligned is supplied to a printed board soldering pad 7. Thus, fine pitch QFPs are individually supplied to a printed board by the same facility as supply of local solder for soldering and component soldering thereby to avoid double investment of the facilities.