To provide: a method of forming, at low temperature, a low-dielectric-constant insulating material layer used to form an organic electronic element by a coating method or printing method; a layer or pattern formed by the method; and the organic electronic element.
The method of forming the low-dielectric-constant insulating material layer includes: a step (a) of applying or printing a first insulating layer-forming material made of a fluoropolymer dispersing element on a base material or on a conductive layer or semiconductor layer forming the electronic element; a step (b) of forming a dry coating film of the fluoropolymer dispersing element; a step (c) of applying or printing a second insulating layer-forming material made of a fluorocarbon copolymer solution on the dry coating film; and a step (d) of forming a dry coating film of the fluorocarbon copolymer solution.
CHIH WEI
EBINE TOSHIHIRO
ISOZUMI HIROSHI
KASAI MASANORI