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Title:
METHOD OF FORMING LOW-DIELECTRIC-CONSTANT INSULATING MATERIAL LAYER, AND LAYER OR PATTERN FORMED BY THE METHOD
Document Type and Number:
Japanese Patent JP2010182862
Kind Code:
A
Abstract:

To provide: a method of forming, at low temperature, a low-dielectric-constant insulating material layer used to form an organic electronic element by a coating method or printing method; a layer or pattern formed by the method; and the organic electronic element.

The method of forming the low-dielectric-constant insulating material layer includes: a step (a) of applying or printing a first insulating layer-forming material made of a fluoropolymer dispersing element on a base material or on a conductive layer or semiconductor layer forming the electronic element; a step (b) of forming a dry coating film of the fluoropolymer dispersing element; a step (c) of applying or printing a second insulating layer-forming material made of a fluorocarbon copolymer solution on the dry coating film; and a step (d) of forming a dry coating film of the fluorocarbon copolymer solution.


Inventors:
WAN SHIRYAN
CHIH WEI
EBINE TOSHIHIRO
ISOZUMI HIROSHI
KASAI MASANORI
Application Number:
JP2009024772A
Publication Date:
August 19, 2010
Filing Date:
February 05, 2009
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
H01L21/312; H01B17/56; H01B19/02; H01L21/768; H01L23/522
Attorney, Agent or Firm:
Kono Tsuyo



 
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