Title:
METHOD FOR FORMING METAL BUMP
Document Type and Number:
Japanese Patent JP2002151535
Kind Code:
A
Abstract:
To provide a method for forming multiple metal bumps with high accuracy while suppressing cost increase.
In the method for forming multiple metal bumps, a die of a semiconductor template having holes corresponding to pads is made and used for forming a ceramic template 8. The ceramic template 8 is coated with metal paste 4 and heated, thus forming a metal ball 5 from the metal paste 4. The metal ball 5 is aligned with a pad 7 provided on a substrate 6 and thermocompressed to form a metal bump.
Inventors:
MIYAZAKI SHINICHI
TAKAHASHI NOBUAKI
HAJIYAMA ICHIRO
TAKAHASHI NOBUAKI
HAJIYAMA ICHIRO
Application Number:
JP2000340167A
Publication Date:
May 24, 2002
Filing Date:
November 08, 2000
Export Citation:
Assignee:
NEC CORP
International Classes:
B23K3/06; H01L21/60; (IPC1-7): H01L21/60; B23K3/06
Attorney, Agent or Firm:
Yoshiyuki Iwasa