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Title:
METHOD OF FORMING METAL SILVER PORTION AND METAL SILVER FILM
Document Type and Number:
Japanese Patent JP2009124180
Kind Code:
A
Abstract:

To provide a method of forming a metal silver portion that forms a thin line pattern of an electromagnetic wave shielding material exhibiting high EMI shieldability and high transparency simultaneously, and that is employed in inexpensive mass production of light-permeable electromagnetic wave shielding film.

A metal silver portion is formed together with a light-permeable portion by exposing a silver salt containing layer provided on a support and containing silver salt and binder at a volume ratio of Ag/binder of 1/3 or above and then carrying out its development.


Inventors:
Morimoto, Kiyoshi
Sasaki, Hirotomo
Nishizakura, Ryo
Takada, Shunji
Application Number:
JP2009000051491
Publication Date:
June 04, 2009
Filing Date:
March 05, 2009
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
H05K9/00; B32B3/24; B32B15/08; C03C17/10; C03C17/36; F24C7/02; G03C5/58; G09F9/00; H01J9/20; H01J11/44; H01J29/86; G02F1/13; G03C1/08
Domestic Patent References:
JPH11170421A1999-06-29
JPH06194762A1994-07-15
JPH0743868A1995-02-14
JP2001281822A2001-10-10
JP2000149773A2000-05-30
Attorney, Agent or Firm:
特許業務法人特許事務所サイクス