METHOD FOR FORMING METAL WIRING FILM

Title:

METHOD FOR FORMING METAL WIRING FILM

Document Type and Number:

Japanese Patent JP2001308029

Kind Code:

A

Abstract:

To fully assure adhesive properties of an insulating film with an electrode layer (seed layer).

The method for forming a metal wiring film comprises the steps of forming an electrode layer 4 on a barrier film layer 3, then heat treating the layer at a high temperature and high pressure gas atmosphere, then forming a coating layer 5 made of a metallic material on the layer 4, and filling the metallic material in a hole/groove 2A.

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Inventors:

FUJIKAWA TAKAO
NARUKAWA YUTAKA

Application Number:

JP2000119835A

Publication Date:

November 02, 2001

Filing Date:

April 20, 2000

Export Citation:

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Assignee:

KOBE STEEL LTD
ULVAC CORP

International Classes:

C23C14/14; H01L21/203; H01L21/28; H01L21/285; H01L21/288; H01L21/3205; H01L21/768; H01L23/52; (IPC1-7): H01L21/28; C23C14/14; H01L21/203; H01L21/285; H01L21/288; H01L21/3205; H01L21/768

Attorney, Agent or Firm:

Toshio Yasuda

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