Title:
金属配線を形成する方法
Document Type and Number:
Japanese Patent JP7117047
Kind Code:
B2
Abstract:
The present invention provides a method for easily forming metal wiring having a line width of not more than 10 μm or a line width of less than 10 μm. The metal wiring forming method according to the present invention comprises: a step for forming a wettability control layer on a substrate by applying, on the substrate, a polymer solution containing at least one type of polymer material selected from the group consisting of cycloolefin polymers, polylactic acids, and derivatives thereof, and polysilazanes, and drying the polymer solution; a step for irradiating the wettability control layer with vacuum ultraviolet rays having a wavelength of at most 200 nm; and a step for applying a metallic ink on the wettability control layer.
Inventors:
Takeshi Samari
Ryu Shuin
Sung Ching Chin
Manri Lee
Ryu Shuin
Sung Ching Chin
Manri Lee
Application Number:
JP2021501926A
Publication Date:
August 12, 2022
Filing Date:
February 14, 2020
Export Citation:
Assignee:
National Institute for Materials Science
International Classes:
H01L21/288; H01L21/28
Domestic Patent References:
| JP2013214649A | ||||
| JP2007150258A | ||||
| JP2007300012A | ||||
| JP2006108506A |
Foreign References:
| WO2009044659A1 |
Attorney, Agent or Firm:
Seiro