Title:
METHOD FOR FORMING MOLD-RELEASED LAYER, AND METHOD FOR PRODUCING SILICONE INGOT
Document Type and Number:
Japanese Patent JP2006326670
Kind Code:
A
Abstract:
To provide a method for forming a mold-released layer on a mold for forming a silicon ingot by which the mold-released layer can be formed on the inner surface of the mold at uniform thickness and strength by restraining the settling of ceramic particles contained in slurry with time.
In the method for forming the mold-released layer 2 by coating and drying the slurry on the inner surface of the mold 1 for forming the silicon ingot, the slurry contains ceramic particles and a cross-linking assistant.
More Like This:
Inventors:
GOTO SHIGERU
Application Number:
JP2005157077A
Publication Date:
December 07, 2006
Filing Date:
May 30, 2005
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
B22C3/00; B22D25/04; C01B33/02
Domestic Patent References:
| JP2002239682A | 2002-08-27 | |||
| JP2002321037A | 2002-11-05 |