Title:
METHOD FOR FORMING ORGANIC INSULATING FILM
Document Type and Number:
Japanese Patent JP2000150502
Kind Code:
A
Abstract:
To provide a method for forming a thick organic insulating film without causing collapse of pattern.
A first photosensitive resin layer 10 formed on a semiconductor substrate 1 is exposed and then a second photosensitive rein layer 13 is formed on the first photosensitive resin layer 10 and exposed. Non-photosensitive parts 12, 15 of the first and second laminated photosensitive resin layer 10, 13 are then etched together with developer liquid and the remaining photosensitive resin is thermally set to form an organic insulating film 17. According to the method, exposure time per step is shortened and a thick organic insulating film can be formed without causing collapse of pattern.
Inventors:
KINOSHITA TAKASHI
Application Number:
JP32468898A
Publication Date:
May 30, 2000
Filing Date:
November 16, 1998
Export Citation:
Assignee:
MATSUSHITA ELECTRONICS CORP
International Classes:
H01L21/312; G03F7/038; G03F7/095; G03F7/26; G03F7/30; G03F7/38; G03F7/40; (IPC1-7): H01L21/312; G03F7/038; G03F7/095; G03F7/26; G03F7/30; G03F7/38; G03F7/40
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)