Title:
METHOD FOR FORMING PHOTO-DEFINED MICRO ELECTRIC CONTACT
Document Type and Number:
Japanese Patent JP2015135350
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that conventional stamp molding used for forming a probe often causes, to the probe, residual stress that could shorten the durable life, and that a probe manufactured by a mechanical method is difficult to redesign.SOLUTION: A method for manufacturing a probe test head for testing a semiconductor integrated circuit includes the steps of: defining a shape 72 of a plurality of probes 81 as one or a plurality of masks 73; manufacturing a plurality of probes using the mask 73; and placing the plurality of probes 81 through corresponding holes in a first die 42 and a second die 44. The step of manufacturing the plurality of probes 81 may include one of photo-etching and photo-defied electric casting.
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Inventors:
FRANCIS T MCQUAID
CHARLES L BARTO
PHILIPPE M TRAKL
CHARLES L BARTO
PHILIPPE M TRAKL
Application Number:
JP2015084538A
Publication Date:
July 27, 2015
Filing Date:
April 16, 2015
Export Citation:
Assignee:
WENTWORTH LAB INC
International Classes:
G01R1/067; G01R1/073; G01R31/26; G01R3/00; G01R31/02; H01L21/00; H01L21/44; H01L21/66; H01R9/00; H01R43/00; H01L
Domestic Patent References:
| JP2001050981A | 2001-02-23 | |||
| JP2002075489A | 2002-03-15 |
Attorney, Agent or Firm:
Asamura patent office