Title:
METHOD FOR FORMING PLATED SURFACE AND SURFACE-OXIDATION- TREATED SURFACE IN LONGITUDINAL DIRECTION ON SURFACE OF LONG-SIZED COPPER MATERIAL
Document Type and Number:
Japanese Patent JPS56139696
Kind Code:
A
Abstract:
PURPOSE:To surely form both plating surface and surface oxidation-treated surface in regulated positions by masking the desired parts of a long-sized copper material, performing surface oxidation treatment, then removing the mask and performing plating treatment. CONSTITUTION:A copper rod 12 having a rectangular section used for stabilizing material for superconductors etc. goes through a degreasing tank 13, a pickling tank 14, etc. and is affixed with masking tapes 15 with adhesives on the top and both side surfaces in a U shape in section. Thence, it is immersed in a surface treating tank 17, whereby blackening treatment is applied on the exposed surface. After rinsing, the masking tapes 15 are removed, and are led to a molten solder plating bath 16', where molten solder plating having a fixed thickness is applied on the exposed surface, after which it is wound on a take-up drum 18.
Inventors:
NAGAOKA SHIROO
HARADA MITSUHISA
HARADA MITSUHISA
Application Number:
JP4148680A
Publication Date:
October 31, 1981
Filing Date:
March 31, 1980
Export Citation:
Assignee:
SHOWA ELECTRIC WIRE & CABLE CO
International Classes:
C25D11/00; C25D11/34; H01B13/00; (IPC1-7): C25D11/34