METHOD FOR FORMING POLYIMIDE INSULATED FILM

Title:

METHOD FOR FORMING POLYIMIDE INSULATED FILM

Document Type and Number:

Japanese Patent JPH07307114

Kind Code:

A

Abstract:

PURPOSE: To provide a high-performance and high-reliability wiring structure by forming a polyimide film with a low stress. 3a

CONSTITUTION: This method is a manufacturing method for forming a multilayered wiring structure body by sequentially laminating, for instance, a first wiring conductor through a first polyimide layer 22, a second wiring conductor 29 through a second polyimide layer 28 and third wiring conductors 31, 32 through a third polyimide layer 30 on a wiring board 24. Polyimide has low thermal expansiveness, and whet polyimide is formed of polyamide acid varnish as its precursor by heating, a heat holding process in the temperature range of 100°C to 160°C for at least 30 minutes (practically and preferably within 5 hours) is included in the heating process. When the heat holding condition is omitted, the sufficient lowering effect of a film stress cannot be obtained.

More Like This:

JP5391618	White film and surface light source using it
JPH09208715	ELASTOMER FILM CONTAINING AT LEAST ONE ACTIVE CHEMICAL SUBSTANCE, AND PRODUCTION AND USE OF THE SAME
JPH06192515	RESIN COMPOSITION FOR MOLDING

Inventors:

TOGAWA HIDEO
OTANI YOSHIHARU
SHOJI FUSAJI
KATAOKA FUMIO

Application Number:

JP9954294A

Publication Date:

November 21, 1995

Filing Date:

May 13, 1994

Export Citation:

Click for automatic bibliography generation Help

Assignee:

HITACHI LTD

International Classes:

C08J5/18; C08G73/10; H01B3/30; H05K1/00; H05K3/46; (IPC1-7): H01B3/30; C08G73/10; C08J5/18

Attorney, Agent or Firm:

Toshiyuki Usuda

Previous Patent: VEHICLE BATTERY PACK UNIT AND VEHICLE INCLUDING THE SAME

Next Patent: battery control system