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Patent Searching and Data


Title:
METHOD FOR FORMING POLYMERIZED FILM, METHOD OF INSULATING AND COATING METAL BY USING THE SAME, AND INSULATED AND COATED METAL CONDUCTOR
Document Type and Number:
Japanese Patent JP2001123114
Kind Code:
A
Abstract:

To solve the problem of difficulty in the formation of a polymerized film having a sufficient thickness in the conventional method for forming an insulating polymer thin film by using an electrolytic polymerization because the surface of a conductor is insulated by the growth of the film.

The metal conductor is dipped in an aqueous solution containing a polymerizable monomer, a supporting electrolyte and an alkylamine, and an electroconductive polymer film is formed by the electrolysis by using the metal conductor as an electrode. The dopant is eliminated from the obtained electroconductive polymer film to provide the objective polymerized film excellent in insulation properties on the electrode surface.


Inventors:
KAWAMURA YUKA
KAWAKAMI TETSUJI
Application Number:
JP30363499A
Publication Date:
May 08, 2001
Filing Date:
October 26, 1999
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01B7/02; C08G73/02; C08G73/06; C09D179/02; C09D179/04; C25D9/02; H01B13/00; H01B13/06; H01B17/62; (IPC1-7): C09D179/02; C09D179/04; C25D9/02; H01B13/00; H01B17/62
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)