Title:
METHOD FOR FORMING PRINTED FILM OF ELECTRONIC MATERIAL
Document Type and Number:
Japanese Patent JP2002091019
Kind Code:
A
Abstract:
To suppress the bleeding and sagging of a printed film of ink of an electronic material in the lateral direction when the ink is injected into a part obtained by partially removing a resist film on a substrate to form the printed film and to enhance the pattern precision of a resistor or the like by the ink.
In the method for forming a printed film of an electronic material, a resist is applied on a substrate 1 to form a resist film 2, the required part of the resist film 2 is removed, ink 4 of the electronic material is injected into the part freed of the resist film 2 to form a printed film, the injected ink 4 is cured and the resist film 2 is optionally removed.
Inventors:
UZAKI SHUNSUKE
Application Number:
JP2000274946A
Publication Date:
March 27, 2002
Filing Date:
September 11, 2000
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B41J2/335; B41M1/12; B41M1/34; G03F7/40; G03F7/42; H05K1/16; H05K3/10; H05K3/12; (IPC1-7): G03F7/40; B41J2/335; B41M1/34; G03F7/42; H05K3/10; H05K3/12
Attorney, Agent or Firm:
Kaneo Miyata (1 person outside)