Title:
METHOD FOR FORMING RAIL BOND
Document Type and Number:
Japanese Patent JP2006334644
Kind Code:
A
Abstract:
To provide a method for forming a rail bond, by which, even when damage such as breaking of wire is generated on the rail bond in a rail way, only a bond conductor is removed from the rail bond terminal, the terminal is left as welded and fixed, and only the bond conductor is replaced.
The rail bond is formed as follows: a rail bond terminal, which is made of a conductive material, and whose end part is made to be inserted by a bond conductor, is welded and fixed to a rail by a copper thermit process at a position in a rail way, where a rail bond is required to be mounted; a bond conductor is inserted into the rail bond terminal welded and fixed to the rail; and the bond conductor is welded and fixed with a low temperature welding material.
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Inventors:
KITADA AKIHIKO
Application Number:
JP2005163153A
Publication Date:
December 14, 2006
Filing Date:
June 02, 2005
Export Citation:
Assignee:
SHINGO KIZAI KK
International Classes:
B23K23/00; E01B37/00; B23K101/26
Domestic Patent References:
JP2005081367A | 2005-03-31 | |||
JP2005014008A | 2005-01-20 | |||
JP2001210397A | 2001-08-03 | |||
JP2004273403A | 2004-09-30 |
Attorney, Agent or Firm:
Toshio Yoshizawa
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