PURPOSE: To form a high resolving power resist pattern by a dry planographic printing system, by using dry planographic printing ink containing a resin component, a metal chelating resin, a polymerizable compound and a fluorocarbon type surfactant and/or a silicone surfactant and curing the printing pattern formed by said ink by the irradiation of active energy rays and/or heating.
CONSTITUTION: Dry planographic printing ink capable of being cured by the irradiation of active energy rays and/or heating containing at least one resin selected from a group consisting of an alkyd resin, a modified alkyd resin, a fatty acid modified epoxy resin, urethane oil and maleinated oil, a metal chelating resin obtained by reacting a metal compound B forming a ligand bond by using the ligand of the resin component A, a polymerizable compound having two or more of ethylenic unsaturated double bond B in one molecule thereof and a fluorocarbon type surfactant and/or a silicone type surfactant is used to print a predetermined pattern on a substrate by a dry planographic printing system and said printing pattern is cured by the irradiation of active energy rays and/or heating.
HISAMATSU HIROYOSHI
YAMAZAKI MASAHIKO
YAMASHITA SHIYOUZOU
