Title:
METHOD OF FORMING ROUGH SURFACE OF METAL THIN PLATE, AND METAL THIN PLATE WITH ROUGH SURFACE FORMED BY THE SAME METHOD
Document Type and Number:
Japanese Patent JP2014124585
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To form a rough surface by easily exposing coarse granular material partially from a resin coating film surface and solidifying it even when a thickness of a covering plate or the like is less than 3 mm.SOLUTION: In a method of forming a rough surface on a metal thin plate, a resin coating film of thermoplastic resin is formed on a thin metal substrate, the metal substrate with the resin coating film formed is mounted on a heating plate, a molten state of the resin coating film is maintained by heating by the heating plate, inorganic coarse granular material in a heated state is sprayed and adhered on the molten resin coating film, the metal substrate is released from a mounted state on the heating plate, and the resin coating film in a state that at least a part of the inorganic coarse granular material is exposed from a surface of the resin coating film is cooled and solidified.
Inventors:
SASAGAWA TORU
KAWASAKI ICHIRO
KAWASAKI ICHIRO
Application Number:
JP2012283241A
Publication Date:
July 07, 2014
Filing Date:
December 26, 2012
Export Citation:
Assignee:
TOTETSU KOGYO CO LTD
KAWANETSU CO LTD
KAWANETSU CO LTD
International Classes:
B05D5/06; B05D7/14; B32B15/08; B32B15/09
Domestic Patent References:
| JPH11172897A | 1999-06-29 | |||
| JP2003127282A | 2003-05-08 | |||
| JP2006044120A | 2006-02-16 | |||
| JP2012192645A | 2012-10-11 | |||
| JP2006069222A | 2006-03-16 | |||
| JP2004216859A | 2004-08-05 | |||
| JP2003127282A | 2003-05-08 | |||
| JP2006044120A | 2006-02-16 | |||
| JP2012192645A | 2012-10-11 | |||
| JP2006069222A | 2006-03-16 | |||
| JP2004216859A | 2004-08-05 | |||
| JPH11172897A | 1999-06-29 |
Attorney, Agent or Firm:
Hayashi Tsunetoku
Kenji Doi
Kenji Doi