Title:
METHOD FOR FORMING SOLDER SHEET
Document Type and Number:
Japanese Patent JPH0569190
Kind Code:
A
Abstract:
PURPOSE: To forming a solder sheet standing in a row with high dimensional precision and high positional precision and to provide a simple and easy method for the above.
CONSTITUTION: A fine film of solder is formed on a base plate of a smooth surface of 'Teflon(R)', etc., with a sputtering method, etc., next, photoresist is coated on the surface of this film, and dried, next, the photoresist except the pattern part is removed by using a negative film protted with the required pattern as a mask, exposing with a exposure phenomenon, the object is achieved by removing the resist after etching this exposed fine film part with pickling, etc.
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Inventors:
YANAGIHARA HIROSHI
Application Number:
JP24514291A
Publication Date:
March 23, 1993
Filing Date:
August 30, 1991
Export Citation:
Assignee:
TANAKA PRECIOUS METAL IND
International Classes:
B23K3/06; B23K35/40; C23C14/18; C23C18/50; B23K101/42; (IPC1-7): B23K3/06; B23K35/40; B23K101/42; C23C14/18; C23C18/50
Next Patent: AUTOMATIC WELDING EQUIPMENT FOR STEEL SHEET PANELS