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Title:
METHOD OF FORMING SPOT-PLATED FILM
Document Type and Number:
Japanese Patent JP2005097714
Kind Code:
A
Abstract:

To provide a method of forming a spot-plated film where, even if a plating area is small, the positional precision of a plated film is not reduced, further, the plating stage is not complicate, and the cost for incidental equipment or apparatuses is not high.

In the method of forming a spot-plated film, a non-plating area in the outer circumference of an area to be subjected to plating in the object for plating is coated with ink to form an ink mask, further, a mechanical mask is applied to the non-plating area in the object for plating so as to apply jet plating, and thereafter, the ink mask is removed.


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Inventors:
OMURA YOSHIHIDE
NAITO YASUAKI
Application Number:
JP2003396907A
Publication Date:
April 14, 2005
Filing Date:
November 27, 2003
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
C25D5/02; (IPC1-7): C25D5/02
Domestic Patent References:
JPH02115388A1990-04-27
JPH05136309A1993-06-01
JPH0846113A1996-02-16
JPH0987887A1997-03-31
JPS5246772A1977-04-13
JPS5779194A1982-05-18
JPS61136699A1986-06-24
JPS62154658A1987-07-09
JPH0216760A1990-01-19
JPH04318187A1992-11-09
JPS60190595A1985-09-28
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito



 
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