Title:
METHOD FOR FORMING THIN LINE PATTERN AND METHOD FOR MANUFACTURING CONDUCTIVE SUBSTRATE
Document Type and Number:
Japanese Patent JP2015153666
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming a thin line pattern, by which a blackened layer and a wiring layer can be simultaneously etched into a desired pattern.SOLUTION: A method for forming a thin line pattern is carried out by etching a metal layer laminate formed on at least one surface of a substrate 11 by using an etching solution for a metal layer laminate. The metal layer laminate includes: a blackened layer 13 containing at least one metal selected from Ni, Mo, Ta, Ti, V, Cr, Fe, Co, W, and Cu, and at least one element selected from carbon, oxygen, and nitrogen; and a wiring layer 12 containing copper or a copper alloy of Cu and at least one metal selected from Ni, Mo, Ta, Ti, V, Cr, Fe, Co, and W. The etching solution for a metal layer laminate contains a permanganate by 0.5 wt.% or more and 10 wt.% or less and hydrochloric acid by 0.1 wt.% or more and 5 wt.% or less.
Inventors:
ASAKAWA YOSHIYUKI
Application Number:
JP2014027994A
Publication Date:
August 24, 2015
Filing Date:
February 17, 2014
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
H01B13/00; B32B15/08; C23C14/06; G06F3/041; G06F3/044
Domestic Patent References:
| JP2002246788A | 2002-08-30 | |||
| JP2014024316A | 2014-02-06 | |||
| JPS5972191A | 1984-04-24 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito
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