Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD OF FRACTIONATING RESIN IN MULTILAYER PLASTIC VESSEL BY STATIC ELECTRICITY AND CRUSHED CHIPS OF MULTILAYER PLASTIC VESSEL USED FOR THE SAME
Document Type and Number:
Japanese Patent JP2003154290
Kind Code:
A
Abstract:

To provide a method of precisely and inexpensively fractionating a multilayer plastic vessel formed from a laminated body composed of different resins to recycle and crushed chips of the multilayer plastic vessel which are capable of efficiently being fractionated in the fractionating method.

The multilayer plastic vessel formed from the laminated body composed of 2 or 3 kinds of the different resins is crushed into fragments having 5-15 mm major diameter with a blade having a dull edge to simultaneously strip off the laminated surface to form a mixture of resin crushed chips separated into respective resins. The mixture is controlled to ≤0.5% water content and resin crushed chips are charged to (+) or (-) respectively in every resins by friction and the charged resin crushed chips are applied to a resin fractionation apparatus to fractionate and recover each resin. It is desirable that the resin crushed chips are heated before the fractionation to be shrunk and curled.


Inventors:
Ota, Mie
Nakai, Kazuhisa
Application Number:
JP2001000355224
Publication Date:
May 27, 2003
Filing Date:
November 20, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B03C7/02; B02C23/08; B03C7/06; B29B17/02; B29B17/04; (IPC1-7): B03C7/02; B02C23/08; B03C7/06; B29B17/02