Title:
METHOD OF GRINDING HOLDING SURFACE
Document Type and Number:
Japanese Patent JP2019130637
Kind Code:
A
Abstract:
To make it possible to hold a wafer with a holding table such that the center of the wafer does not become thinner after the wafer is ground.SOLUTION: A method of grinding a holding surface according to the present invention includes: a first grinding step of relatively tilting a rotation axis 100 at the center of a grinding wheel 13 and a rotation axis 200 at the center of a holding table 21 to make a ground surface 14a contact with a holding surface 24a from the circumference E to the center C of the holding surface to thereby form a substantially conical holding surface 24a with the center C of the holding surface 24a as the apex; and a second grinding step of relatively changing the tilt of the rotation axis 100 of the grinding wheel 13 and the rotation axis 200 of the holding table 21 into a direction in which the rotation axis 100 and the rotation axis 200 become substantially parallel to thereby grind a central portion of the holding surface 24a by a grinding stone 14, thus making it possible to form a recessed portion 26 at the center of the holding surface 24a. As a result, the wafer can be held by the holding surface 24a with no gap to thereby allow the wafer to be ground to a uniform thickness.SELECTED DRAWING: Figure 3
Inventors:
MIURA OSAMU
NAGAI TAKESHI
KIKAWA YUKIKO
NAGAI TAKESHI
KIKAWA YUKIKO
Application Number:
JP2018016323A
Publication Date:
August 08, 2019
Filing Date:
February 01, 2018
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B41/06; B24B7/04
Domestic Patent References:
| JP2015131354A | 2015-07-23 | |||
| JP2014037020A | 2014-02-27 | |||
| JP2014024153A | 2014-02-06 | |||
| JP2007059949A | 2007-03-08 | |||
| JP2016016462A | 2016-02-01 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office