To provide a method for grinding an optical device wafer which can thin the optical device wafer configured by laminating an optical device on the surface of a sapphire substrate without damaging the wafer.

The method for grinding the optical device wafer configured by forming the optical device on the surface of the sapphire substrate includes: an outer peripheral surface grinding process for grinding the outer peripheral surface of the optical device wafer from the rear side to the surface side at a predetermined diameter expansion angle like a conical surface; and a rear grinding process for grinding the rear face of the optical device wafer subjected to the outer peripheral surface grinding processing to grind the wafer up to a predetermined thickness.